Usual off-the-shelf heatsinks are an unsightly necessary evil when designing power electronics.
This concept of a 3D-printed enclosure for high-end amplifiers however emphasizes the necessary
cooling surface as their main design element.
1 | Sintered aluminium chassis with large surface area
2 | Bottom plate
3 | Volume controls for backup and calibration
4 | Audio inputs
5 | Power connection
6 | Audio outputs
I updated this project slightly after taking part in the 3D Pioneers Challenge.
Special thanks to
for making a full-size model for the Rapid.Tech & Fab.Con 3.D 2018.
© 2020 Joris Wegner